-40%
Chemtronics 80-3-5 Size #3 Soder Wick Rosin SD Desoldering Braid
$ 3.95
- Description
- Size Guide
Description
Soder-Wick Rosin Flux Desoldering WickSoder-Wick
brand desoldering wick offers the state of the art in desoldering technology. Soder-Wick
®
is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick
®
responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. Used to remove solder on through-hole, surface-mount, and ball-grid-array pads.
FEATURES & BENEFITS
Soder-Wick® Rosin 5' spools packaged in ESD-safe static dissipative bobbins
Minimizes the risk of damage associated with static electricity
Noncorrosive ultra high purity Type R rosin flux
Minimizes the risk of heat damage to the boardThis
Will not leave ionic contamination on the boards
APPLICATIONS
Soder-Wick® Rosin safely removes solder in all applications requiring Type ROL0 rosin flux
BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
SPECIFICATIONS:
MIL-F-14256 F type R flux
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
ANSI/IPC J STD-004, Type ROL0